Manufacturing Engineer Packaging & OSAT

Role overview A hands-on Manufacturing Engineer is needed to bridge advanced semiconductor package design and high-volume outsourced assembly and test (OSAT) operations. The role sits at the intersection of package engineering, silicon manufacturing, board assembly, and final product integration, owning how new packages become manufacturable, qualified, and transferred into partner factories. It is a remote position based in Taiwan with frequent on-site engagement at regional partner facilities across multiple time zones.

Responsibilities - Translate package design requirements into executable assembly process flows, manufacturing specifications, control plans, inspection criteria, and complete documentation packages for suppliers and partners. - Lead factory commissioning, line bring-up, pilot and engineering builds, qualification lots, first article inspections, reliability activities, and production readiness reviews. - Define and track process capability and performance targets such as Cp/Cpk, yield, first-pass yield, defect rates, cycle time, OEE, and on-time delivery, applying SPC, DOE, PFMEA, 8D, and CAPA methods. - Drive technical issue resolution and controlled change implementation across silicon, package, assembly, test, and factory operations, including nonconforming material disposition, engineering change orders, supplier and material changes, and requalification efforts. - Partner directly with OSATs, substrate and bumping suppliers, test houses, and contract manufacturers to qualify processes, audit capability, and sustain high-volume output. - Collaborate with packaging engineering, silicon manufacturing and test, quality, supply chain, and PCB or board design teams to align decisions on package size, substrate construction, bump and ball design, warpage, underfill, and BOM.

Requirements - Five or more years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, NPI, or a closely related field. - Demonstrated experience taking a package, assembly process, or manufacturing line from development through sustaining operations, including package test and final product manufacturing. - Comfortable working hands-on with external manufacturing partners such as OSATs, substrate suppliers, test houses, and contract manufacturers. - Strong data-driven problem-solving skills with the ability to interpret package drawings, BGA maps, BOMs, PCB data, process and quality reports, reliability results, and manufacturing documentation. - Effective communicator who can drive decisions across engineering, operations, quality, and supplier teams. - Willingness to travel regularly to partner factories in the region during qualification, commissioning, build, and ramp phases.

Nice to have - Exposure to advanced compute or AI silicon products and the OSAT ecosystem that supports them. - Familiarity with process transfer, factory commissioning, and ramp activities for complex semiconductor packages. - Understanding of how silicon and package design choices affect test coverage, yield, reliability, and production cost.

Benefits and work setup - Remote position based in Taiwan with close collaboration across multiple time zones and on-site presence at partner factories during key program phases. - Competitive compensation and benefits package. - Equal opportunity employer.