Principal Package Engineer

Role overview Architect and deliver advanced multi-die packages for high-performance accelerator systems. The work covers package selection, substrate and interconnect definition, signal and power routing, manufacturability, and coordination with design teams and external packaging partners from architecture through bring-up and qualification.

Responsibilities - Select package approaches, such as MCM, 2.5D, 3D, fan-out, or other advanced options, balancing electrical and thermal performance, cost, and manufacturability. - Define package specifications, bump and ball maps, interposer needs, and mechanical constraints. - Set substrate stack-ups, pitches, routing, via structures, and material choices. - Design high-speed signal escape and routing, along with package power distribution. - Coordinate subcontractors and engage foundry or assembly partners on bumping, substrate choices, and packaging flows. - Work with IC design, physical design, SI/PI, and board teams; support package bring-up, failure analysis, debugging, and qualification.

Requirements - Bachelor’s or master’s degree in electrical engineering or a related field. - Experience designing multi-die packages and integrating UCIe, including advanced or standard package interfaces. - Understanding of substrate materials, stack-ups, and mechanical constraints. - Familiarity with signal- and power-integrity concepts sufficient to work with electrical design teams. - Experience managing packaging subcontractors and coordinating with foundry or OSAT partners on bumping and package options.

Nice to have - Experience with package modeling tools such as HFSS, Sigrity, or similar.